Deep vertical holes and re-entrant features challenge the best metrology methods.

For several decades, NAND Flash has been the primary technology for low-cost and large-density data storage applications. This non-volatile memory is present in all major electronic end-use markets, ...

The part 1 of this two-article series outlined the NAND flash technology and how it transitioned from 2D to 3D NAND flash. The article also explained the current challenges in the way of density ...

Kitguru.net Hardware editors Leo Waldock and Luke Hill discuss 3D nand and which ssd interface is going to be the most widely ...

Samsung researchers have published a detailed account of an experimental NAND architecture that aims to cut one of the technology’s largest power drains by as much as 96%.

Samsung Electronics is keenly exploring "hafnia ferroelectrics" as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers of 3D NAND and ...

Micron Technology recently unveiled 176-layer, triple-level-cell (TLC), 3D NAND flash memory with a 30% smaller die size that employs a new replacement-gate (RG) NAND technology. The chips offer a 35% ...

Austin, Oct. 13, 2025 (GLOBE NEWSWIRE) -- 3D NAND Flash Memory Market Size & Growth Insights: According to the SNS Insider,“The 3D NAND Flash Memory Market Size was USD 20.67 Billion in 2024 and is ...

Braving the headwinds facing the NAND flash market, China's Yangtze Memory Technologies (YMTC) is set to commercialize new capacity at its second NAND plant in the country by the end of 2022 looking ...

Micron's new fifth-generation 176-layer 3D NAND flash is the same height as its 64-layer memory, but packs in 2.75 times more layers in the same space--a space that's 30% smaller than today's leading ...

Traditional 2D NAND-based flash memory has been a workhorse of our digital storage economy, but its architecture has reached its physical limits, so suppliers are moving on to the next generation: 3D ...

Achieving improvements in performance in advanced SoCs and packages — those used in mobile applications, data centers, and AI — will require complex and potentially costly changes in architectures, ...